CONNTECT! Moldflow® User Meeting 2011 - Tuesday, 17. 05. - Wednesday, 18. 05. 2011 Frankfurt

 

sponsors:


Autodesk Financing

Stream Engeneering

HRS Flow

Volume Graphics GmbH

Contura

Contura

DYNAmore
mensch+maschine


2013 - A Strong European Community - Be In Sight! - Reminder

11. June 2013 to 12. June 2013

 

4. European Moldflow® User Meeting

in Frankfurt/Main organized by MF SOFTWARE

 

Don’t miss to sign up for the CONNECT! European Moldflow User Meeting 2013!


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Read on to learn more about this year's lectures, which are translated with the help of experienced live translators from English to German and vice versa.

 

Listen to international speakers like:

 

 

Dr. Alan R. Wedgewood (USA) & Mattia Sulmoni (CH), DuPont
Accurate Fiber Orientation Prediction for Injection Molded Short Glass Fiber Reinforced Thermoplastic Parts

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To accurately predict many key performance properties of parts made by injection molding fiber reinforced thermoplastic polymers, correct predictions of the fiber orientation and aspect ratio are required. Since experimental determination of the fiber orientation throughout a part is impracticable at this time, mold filling simulation models are necessary to predict the fiber orientation throughout a part. Autodesk Moldflow® simulation software offers various models for prediction of the fiber orientation. The fiber interaction parameters in these models are determined by making comparisons between Moldflow® simulations and experimental measures of the fiber orientation. Optimization of the model parameters requires an advanced understanding of assumptions made by the Moldflow® simulation software and experimental orientation measurement method. Likewise, a similar understanding is required for the assumptions made by other verification calculations, such as anisotropic modulus. This presentation provides new insights into the optimization of the Moldflow® model parameters and offers improvements of the experimental fiber orientation measurement. These advancements are illustrated with measurements made on DuPont Zytel® products.

 

Tony Amende, Fraunhofer IZM (D)
Microchip Encapsulation and Wire Sweep Simulation with Autodesk Moldflow

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State of the art control units are typically placed in hermetic housings. Therein the electronic board is placed and the active and passive components are commonly connected with bonding wire technologies to achieve the electronic functionality. The requirements on the reliability of hermetic houses are very high especially as the product lifetime is long and the bonding wires are progressively thinner in diameter for future applications. One major failure source in these state of the art housings is the malfunction caused by vibrations. Here, the unsupported bonding wires can short cut easily as the distance between wires is only about two times the wire diameter. This problem can be overcome when the whole package is encapsulated in future applications. Therefore reactive moulding compounds can be used and processed within the transfer moulding technology at low pressures. This process has the advantage that sensitive components can be encapsulated without destruction. The generation of the non-trivial 3D constructions and the transfer into Autodesk Moldflow with first results will be treated in this presentation so that future fabrication processes can be evaluated and optimized virtually.

 

Dr. Gilles Robert, Solvay - Rhodia Engineering (F)
Use of Moldflow for Integrative Simulation: Accuracy in Different Situations

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Integrative simulation of fibre reinforced polymers requires an information about local fibre orientation which is most of the time generated by Moldflow, and constitutive models for matrix behaviour. It appears that for complex structures, accuracy of computations made with Molflow is good enough to ensure a very good global performance of integrative simulation, when constitutive models are reliable enough. However, identification of such models cannot be done using orientation data generated with Moldflow : measured microstructures are the only one which ensure a satisfying performance of identifications.

 

Dr. Andreas Wonisch, BASF SE (D)
Numerical Optimization of the Gating Points of Injection Molded Plastic Parts

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The position of gating points has a great relevance for injection molded plastic parts. It influences the flow behavior and thereby pressure loss, weld lines and fiber orientation. The exact position impacts directly the mechanical behavior and especially the general tendency of Warpage.
This talk shows how to use Autodesk Simulation Moldflow and special optimization software to perform a fully automated numerical optimization of the gating position – given any user-defined specification.
In addition to the underlying workflow two sample applications will be presented. The first one will demonstrate how the Warpage of the sealing face of a two-component-lid can be reduced significantly by optimizing the gating position. The second example shows the successful balancing of a multi-cascade of a LBS part (Lower bumper stiffener).

 

Uwe Frigge, Phoenix Contact GmbH (D)
Automated Evaluation of Warpage

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The simulation of deformation with a model of 1.6e6 tetrahedra and 300000 nodes only takes a few minutes. In comparison, much time must be spent on the evaluation of the deformation of only a few edges and surfaces. This paper covers how the evaluation of the deformation can be considerably simplified through automation, independent from mesh and position.

 

Hot Runners

Don’t forget your running shoes!

On 12 June 2013 staff members of MF SOFTWARE, PEG and Synventive invite you to join their running group before breakfast.

 

We are looking forward to your participation!


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