CONNTECT! Moldflow® User Meeting 2011 - Tuesday, 17. 05. - Wednesday, 18. 05. 2011 Frankfurt

 

sponsors:


Autodesk Financing

Stream Engeneering

HRS Flow

Volume Graphics GmbH

Contura

Contura

DYNAmore
mensch+maschine


2012 - Report - CONNECT! Moldflow User Meeting 2012

Prediction of fiber orientation dominated CONNECT! 2012


In numerous presentations and discussions it became obvious that the new RSC fiber solver leads to excellent results in the prediction of fiber orientation. Behind the scenes many material manufacturers additionally research on fine-tuning depending on the classes of materials.

Altogether based on a mood barometer of a survey it was shown a large satisfaction of the participants with the development capabilities provided by Autodesk. The intensive development efforts, which can be seen as well on the significant enhancement of the 3D Cool Solver, will not abate by Autodesk in the future.

A special highlight was the guest speaker from the Unites States, Mr. David A. Okonski (GM), who stressed the importance of the material data to the simulation results.

The participants also expressed widespread interest in special trainings. These will be offered soon. 

In a final survey about the event all respondents signaled that they would like to return next year. Participants from neighboring European countries have announced to inform further Moldflow Users for the next year and bring them along.

 

Thank you very much for your great confidence!

 

Fife Questions to Autodesk® Moldflow® Senior Research Leader Dr, Franco Costa

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1. Question:
Can we expect a new Technology preview? What’s will be the focus?

Answer:
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2. Question:
We did see new developments in 3D Cool FEM, we also saw that with the new CFD simulation you can do thermal calculations. Where is the border between the two products/programs? Can the products work together, or do you forsee a ‘merging’ of the two products?

Answer:
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3. Question:
We saw in a few presentations that with the new RSC model, that there are material specific ci/dz values that in some cases provide the best results. Do you plan to store these ‘experience values’ in the database? Or do you expect changes to the default solver parameters?

 Answer:
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4. Question:
How do you value the CONNECT! Moldflow User Meeting from the Autodesk perspective?

 Answer:
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5. Question:
What will be there in the 2014 release? Anything new?

Answer:
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Ihr MF SOFTWARE Team

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